{"id":1272,"date":"2019-09-24T07:46:53","date_gmt":"2019-09-24T07:46:53","guid":{"rendered":"https:\/\/digitone.news\/?p=1272"},"modified":"2019-09-24T07:46:54","modified_gmt":"2019-09-24T07:46:54","slug":"intel-lead-series-b-investment-in-dustphonics","status":"publish","type":"post","link":"https:\/\/digitone.news\/index.php\/2019\/09\/24\/intel-lead-series-b-investment-in-dustphonics\/","title":{"rendered":"Intel Lead Series-B Investment in DustPhonics"},"content":{"rendered":"\n<figure class=\"wp-block-image\"><img loading=\"lazy\" decoding=\"async\" width=\"864\" height=\"645\" src=\"https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/Intel.jpg\" alt=\"INtel\" class=\"wp-image-1273\" srcset=\"https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/Intel.jpg 864w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/Intel-300x224.jpg 300w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/Intel-768x573.jpg 768w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/Intel-80x60.jpg 80w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/Intel-265x198.jpg 265w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/Intel-696x520.jpg 696w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/Intel-563x420.jpg 563w\" sizes=\"auto, (max-width: 864px) 100vw, 864px\" \/><figcaption>Intel Headquarters<\/figcaption><\/figure>\n\n\n\n<p>Intel Capital has led a Series-B investment in DustPhonics. Intel was joined by WRVI Capital and Avigdor Willenz, in the $25 million round. DustPhonics specializes in optical modules for high speed communications in data centers and other high demand usages. The investment by Intel is a clear endorsement of DustPhonics technology by the chip giant.<\/p>\n\n\n\n<p>Ben Rubovitch, CEO and co-founder of DustPhotonics said, &#8220;We are honored to have Intel Capital lead this round, which will help accelerate our vision of next generation optical connectivity.&#8221; Ben added, &#8220;Our optical transceiver products address the key and challenging requirements for hyper-scale applications, and we will also leverage our electro-optic technology in high-density, future architectures.&#8221;<\/p>\n\n\n\n<figure class=\"wp-block-image\"><img loading=\"lazy\" decoding=\"async\" width=\"936\" height=\"467\" src=\"https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/dustphonics.jpg\" alt=\"\" class=\"wp-image-1274\" srcset=\"https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/dustphonics.jpg 936w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/dustphonics-300x150.jpg 300w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/dustphonics-768x383.jpg 768w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/dustphonics-696x347.jpg 696w, https:\/\/digitone.news\/wp-content\/uploads\/2019\/09\/dustphonics-842x420.jpg 842w\" sizes=\"auto, (max-width: 936px) 100vw, 936px\" \/><figcaption>Team Dustphonics<\/figcaption><\/figure>\n\n\n\n<p>As data rates double with every successive generation, so does the complexity for meeting the demand of lower cost, lower power and higher reliability. Technology innovations, like AuraDP&#x2122;, provide a significant value differentiation enabling superior performance and sustainable 100, 400 and 800 Gb\/s products.<\/p>\n\n\n\n<p>&#8220;High speed optical connectivity is essential to enabling the performance and scale of today&#8217;s data centers,&#8221; said Hong Hou, Vice President of the Data Center Group and General Manager of the Silicon Photonics division at Intel. &#8220;The DustPhotonics products complement our leading optical transceiver portfolio through short-reach, standards-based interconnects based on VCSEL technology.&#8221;&nbsp;<br><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Intel Capital has led a Series-B investment in DustPhonics. Intel was joined by WRVI Capital and Avigdor Willenz, in the $25 million round. DustPhonics specializes in optical modules for high speed communications in data centers and other high demand usages. The investment by Intel is a clear endorsement of DustPhonics technology by the chip giant. [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":1273,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[32,41],"tags":[],"class_list":{"0":"post-1272","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-electronics","8":"category-finance"},"_links":{"self":[{"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/posts\/1272","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/comments?post=1272"}],"version-history":[{"count":1,"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/posts\/1272\/revisions"}],"predecessor-version":[{"id":1275,"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/posts\/1272\/revisions\/1275"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/media\/1273"}],"wp:attachment":[{"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/media?parent=1272"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/categories?post=1272"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/digitone.news\/index.php\/wp-json\/wp\/v2\/tags?post=1272"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}